Shenyang makes integrated circuit breakthroughs

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Beijing, Nov.3 (People's Daily Online) --As a major national science and technology special project, a prototype of a 12-inch Plasma Enhanced Chemical Vapor Deposition, or PECVD, was made in Shenyang for the first time, which marked significant progress for China toward the localization of key integrated circuit equipment under independent development.

As one of the four crucial parts of the process of chip fabrication, 12-inch PECVD represents the standard of thin film deposition equipments in the world. Citing the National Long-term Plan for Science and Technology Development, the integrated circuit manufacturing industry and 15 other projects can enjoy special support from the government.

Thanks to the 11th Five-Year Plan, the project of "90-65 nm Plasma Enhanced Chemical Vapor Deposition (PECVD) Equipment Reach, Development and Industrialization" was listed as one of the first projects which could obtain special policy support. With a total investment of 350 million yuan, it is the first and also the only project that has been implemented in Shenyang as of now.

It is reported that this equipment can move into the market after passing customers' online tests.